NovaSensor designs and fabricates MEMS piezoresistive pressure-sensor die and packaged sensors using patented silicon-fusion-bonding processes. Coverage spans absolute, gauge, sealed-gauge and differential pressure from 500 Pa to 100 MPa — bare die, surface-mount, media-isolated stainless-steel and disposable medical packaging — for medical, industrial, automotive and aerospace OEMs that integrate the sensor into their own product.