Panel-mount CoBeam2™ transmitter
Applications
- BESS enclosure ΔP — detects thermal-event overpressure early
- Range
- ±0.25 inH₂O bidirectional
- Accuracy
- ±0.5% FSO
- Output
- 4–20 mA (2-wire)
Data center sensing
What we measure
Explore sensor technologies mapped to Battery Packs · BMS · PCS · Containerized · Thermal · Fire Safety. Product application notes below identify where each sensor fits within this data center sub-system.
Available technologies
27 products · 7 categories
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Panel-mount CoBeam2™ transmitter
Applications
SMT MEMS + ASIC in miniature housing
Applications
Custom variant
SMT tape-and-reel with customer-logo marking for OEM PCB integration; digital (I²C/SPI/SENT) and analog variants share pinout; barometric-only NPA-700 range for altitude compensation.
Board-mount piezoresistive ΔP
Applications
Low-Cost Media-Compatible P+T
Applications
Custom variant
LCMC is a platform, not a single SKU — specify range, interface (I²C / SPI / 4–20 mA / SENT), process connection and cable pigtail per CDU / compressor integration. No oil-fill keeps it glycol- and refrigerant-safe.
Screw-fixed surface NTC
Applications
Acid/moisture-resistant coated chip
Applications
Resin-coated NTC with RF decoupling
Applications
Non-contact IR temp modules
Applications
OEM board-level T+RH
Applications
Rugged ambient, ChipCap 2 core
Applications
OEM NDIR module with ABC Logic™
Applications
Epoxy-hardened waterproof transmitter
Applications
Capacitive RH + T with integrated ASIC
Applications
MEMS thermal air-velocity sensor
Applications
BESS internal-pack pressure & ROC
Applications
Custom variant
Optional SENT single-wire interface for direct BMS integration where CAN bus is saturated; custom pressure range (e.g. tight-window 80–150 kPa) on request for specific pack geometries.
Thermal-conductivity H₂ + CO vent sensor
Applications
Functional-safety H₂ leak sensor
Applications
Module-level H₂ sensor
Applications
Custom variant
15 mm SMT package reflows onto BMS / monitoring PCBs; ratiometric output pairs with any 16-bit ADC. Tape-and-reel for volume PCB assembly.
H₂ + P + T + RH in one module
Applications
RLDS-B / RLDS-P / RLDS-E controllers
Applications
Custom float and leak switches (point level)
Applications
Custom variant
Built-to-order: specify stem length, float material, switch action (N.O./N.C.), process fitting, cable and connector. Rochester Quick-Turn (Coppell, TX) builds from the 9871 / 9872 / 9873 / 9875 families — IATF 16949 North-American manufacturing, OEM-volume capable.
Open-loop Hall-effect current sensor
Applications
Custom variant
Split-core (clamp-on) retrofit variant for installation on live feeders without disconnecting wires; custom window geometry for non-standard busbar sections on request.
3-phase busbar current sensor
Applications
Custom variant
3-phase press-fit housing matches Infineon HybridPack busbar geometry; DC-capable Hall core for BESS and rectifier sections; customer-specified range and output via ASIC trim.
A-2130 design-in kit (Type YQ / PTF)
Applications
NTC discs for inrush current limiting
Applications
Custom variant
Complementary to the PTC current-limiter family — both ship from the same St. Marys, PA facility and share the A-2130 multi-product design-in kit. PTC starts low-resistance and rises (over-current latch protection); NTC starts high cold-resistance and drops as it heats (soft-start of large capacitive loads). Pair the two for full inrush + over-current coverage in DC-bus pre-charge, server PSUs, UPS, BESS PCS and motor-drive front-ends.
SIP through-hole T+RH module
Applications
IP65 NDIR CO₂ sensor for OEM
Applications